Senior Director, Mechanical Engineering

Role overview

The published role leads mechanical and electrical engineering for a thermal-processing product line in China. It covers technical direction, team development, project delivery, product improvement, and coordination with global and local stakeholders.

Leadership and planning

Lead mechanical design and development against the product roadmap and business strategy.

Set technical priorities and implementation plans; coach the team and develop its talent pipeline.

Product development

Lead new thermal-processing equipment development across performance, reliability, cost, manufacturability and maintainability.

Contribute concepts, feasibility analyses, design reviews, Design FMEA and cross-functional design discussions.

Critical systems

Analyze and design wafer handling systems and precision subsystems, including robot arms, particle control, vacuum interfaces, end effectors, slit valves, lift pins, indexers and cooling stations.

Meet semiconductor requirements for contamination control, thermal performance, alignment, reliability and safety; develop installation/maintenance fixtures as project scope requires.

Engineering execution

Develop system recommendations, architectures, mechanical schemes, 3D models, 2D drawings and bills of materials.

Manage engineering changes; define test plans, specifications and performance metrics; meet company, regulatory and customer requirements.

Collaboration and support

Coordinate with Process, Electrical, Software, Manufacturing, Quality, Supply Chain and Field Service teams for NPI and lifecycle support.

Work with customers and suppliers, support critical escalations and guide prototype/production equipment assembly, commissioning and testing.

Lead root-cause analysis and design improvements; use SAP, Creo, SolidWorks and other engineering/PLM tools.

Apply thermodynamics, heat transfer, metrology and control, stress analysis, and system integration to resolve complex engineering challenges; champion design innovation and improve product performance, cost, reliability and maintainability.

Requirements

Bachelor’s degree or above in Mechanical Engineering, Mechatronics, Automation or related discipline.

At least 10 years of semiconductor-equipment mechanical R&D and at least 5 years leading engineering teams. RTP, MSA or EPI experience is preferred.

Strong mechanical R&D, engineering change, problem-solving and project management; ability to balance cost, maintainability, manufacturability and delivery.

Experience with Creo, SolidWorks, AutoCAD, SAP, MS Office and MS Project; PLM/ERP experience is a plus.

Cross-functional leadership, customer orientation, communication, mentoring and resilience. Chinese required; English is a plus.

Hiring company description

The original advertisement describes a China-headquartered semiconductor equipment company with R&D and operations in China, the US and Germany, serving chip manufacturers in wafer processing. The claims about market position and customer base are reproduced as published and have not been independently verified.